2024
IEEE RAO R. TUMMALA ELECTRONICS PACKAGING AWARD
Sponsored by the IEEE Electronics Packaging Society and Friends of Rao R. Tummala
“For contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems.”
Over his illustrious career, Madhavan Swaminathan has consistently taken a lead role in offering solutions for engineers to effectively create high-performing designs. His work has led to a fundamental understanding of power distribution networks (PDNs), design of package architectures that improve power efficiencies, and glass packaging for millimeter wave (mm wave) applications. These efforts laid the foundation for several commercially available modeling tools, along with delivering significant performance improvements for high-speed computing, wireless, and mixed signal electronic systems. Swaminathan literally wrote the book on modern PDNs, as the book he authored on the subject is now used by universities and industry worldwide.
An IEEE Fellow, Swaminathan is Department Head of Electrical Engineering, William E. Leonhard Endowed Chair, and Director of CHIMES (an SRC JUMP 2.0 Center), College of Engineering, Penn State University, Pennsylvania, USA