2025
IEEE RAO R. TUMMALA ELECTRONICS PACKAGING TECHNOLOGY AWARD
Sponsored by the IEEE Electronics Packaging Society and Friends of Rao R. Tummala
“For contributions to industry-leading high-bandwidth networking systems, including advanced IC and Si-Photonic packaging.”
Jie Xue is a technologist with three decades of contributions to high-performance networking systems and mobile wireless communications. As an engineering leader at Cisco for over 24 years, she led her team to develop system-level packaging technology roadmaps, driving a 20-fold bandwidth increase across generations of networking systems. Xue’s innovations encompass two crucial areas of packaging technologies, pushing industry boundaries with achievements like the large body size Fan-Out package for high-bandwidth and high-performance networking ASICs. Recognizing the need of technology transition to address power constraints in datacenter, she led the team in the eco-system development of Si-Photonic technology. Overall, her visionary leadership has had a transformative impact on the global networking industry.
An IEEE Fellow, Xue is Vice President of Technology and Quality, Cisco Systems, Inc., San Jose, CA, USA.