IEEE Rao R. Tummala Electronics Packaging Award

Presented to

An individual or a team of not more than three

Scope

For outstanding contributions to advancing components, electronic packaging, or manufacturing technologies

Prize

The award consists of a bronze medal, certificate, and cash honorarium.

Basis for judging

In the evaluation process, the following criteria are considered: enhancement of technology, impact on the relevant technical community and the profession, benefit to society, and the quality of the nomination. The technical field for this award includes all aspects of device and systems packaging, including packaging of microelectronics, optoelectronics, RF/wireless, and micro-electro-mechanical systems
(MEMS).

View Award Recipients